SS34 SMD Diode SMAF 50 Mil


Specification

Product Name: SS34 SMD Schottky Barrier Diode 50 MIL
Package Size: 50 MIL (SMAF)
Reverse Voltage (VR): 40V
Forward Current (IF): 3.0A

Application: Suitable for low voltage, high-efficiency rectification in power supplies, DC-DC converters, battery chargers, and reverse polarity protection circuits. Ideal for applications requiring low forward voltage drop and fast switching performance.

0.75 (Excluding Tax)

SS34 SMD Diode โ€“ SMAF Package, 50 Mil | 3A 40V Schottky Barrier Rectifier

The SS34 SMD Diode in SMAF 50 Mil package is a high-performance Surface Mount Schottky Barrier Rectifier designed for modern PCB applications where space efficiency and fast switching are critical. With a chip size of 50 Mil, this variant offers superior thermal handling compared to standard 40 Mil or 45 Mil chips.

ย Key Specifications

Parameter Value
Package Type SMAF (Surface Mount)
Chip Size 50 Mil
Max Repetitive Reverse Voltage (VRRM) 40V
Average Forward Current (IO) 3A
Forward Voltage Drop (VF) 0.55V @ 3A
Surge Current Capability 100A
Operating Temperature -55ยฐC to +150ยฐC
Compliance RoHS Compliant

Why Choose SMAF 50 Mil Over Standard SS34?

The 50 Mil chip size in SMAF packaging provides a larger metal-semiconductor junction area compared to the standard 40 Mil variant. This directly translates to:

  • Better heat dissipation under continuous load
  • Higher reliability in demanding power circuits
  • Lower thermal resistance for improved long-term performance
  • Ideal for high-density PCB designs requiring compact but powerful rectification

ย Applications

  • DC/DC Converters & Switching Power Supplies
  • Freewheeling Diode in Motor Drive Circuits
  • Reverse Polarity Protection
  • High-Frequency Rectification Circuits
  • Secondary Rectification in SMPS
  • ESC (Electronic Speed Controller) circuits
  • Automotive Electronics
  • Industrial Control Systems
  • Communication Equipment

ย Package Details

The SMAF (Small Molded Asymmetric Footprint) package is an evolution of the standard SMA (DO-214AC) package, featuring a slightly different footprint that offers better board attachment and improved thermal performance โ€” making it increasingly preferred in production-grade designs.

ย Product Highlights

  • Clip-bonded leg structure for reduced electrical resistance
  • Guard ring design for mechanical stress protection
  • Equivalent to 1N5822 in SMD form
  • Compatible with automated SMT pick-and-place assembly
  • Tape & Reel packaging available for bulk orders

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